Sn Pb Tin Lead Solder Wire

Description

Lantytk Sn-Pb tin lead solder wire is made from pure tin ingot and highly purified 1# lead ingot. This type of solder wire contains very little impurity. Our solder is processed through advanced melting and manufacturing technique. It is widely used for manual soldering or automatic iron soldering operations in the electronics and component assembly industry.

Features of Sn-Pb Tin Lead Solder Wire

1. Good wettability and expandability make it able to prevent the phenomena of bridging and icicle effectively.

2. Oxide film can be easily removed and its surface can be coated with tin fast.

3. Little spatter, smog and smell are generated during soldering.

4. After soldering, there is little residue produced and clean is not necessary. In addition, the tin lead solder is of high insulation resistance and excellent electrical performance.

5. Soldering flux is evenly distributed with good continuity.

Sn-Pb Tin Lead Solder Wire

Tin%	Lead%	Silver%	Others%	Solidus Temperature (℃)	Liquidus Temperature (℃)	Density (g/cm3)
95	5			183	222	7.42
90	10			183	213	7.55
85	15			183	205	7.70
80	20			183	199	7.85
75	25			183	192	8.00
70	30			183	186	8.16
65	35			183	184	8.33
63	37			183	183	8.40
60	40			183	191	8.50
55	45			183	200	8.68
50	50			183	212	8.87
45	55			183	227	9.07
40	60			183	238	9.28
35	65			183	247	9.50
30	70			183	257	9.72
25	75			183	268	9.96
20	80			183	280	10.21
15	85			183	288	10.70
10	90			275	302	10.75
5	95			308	312	11.06
62	36	2		179	180	8.41
55.5	40.5		4Bi	170	197	9.21

Why choose us?

1. We are manufacturer of Sn-Pb tin lead solder wire. You can buy suitable products you need at reasonable price.

2. Our customer service personnel will provide you with competitive quotation. Your orders and requirement will be dealt as soon as possible.

3. Professional sales engineers are available to recommend the most suitable solder products for your application and to help solve problems you may meet during using.

4. We can accept OEM or ODM. Your brand name and logo can be printed on the solder reel.

5. Small order is also welcomed. We promise prompt delivery.

6. Training for related product knowledge can be provided.

Tin Lead Solder Flux

Code Item	LC--T-1	LC--H-1	LC--P-1	LC--HF01	LC--WS01
Flux Content (%)	2.2 ± 1.0	2.5 ± 0.5	2.2 ± 1.0	3.0 ± 0.5	2.5 ± 0.5
Halide Content (%)	0.05-0.1	< 0.05	< 0.05	0	0.1-0.2
Fluorine Content (%)	None	None	None	None	None
Silver Chromate Test	Pass	Pass	Pass	Pass	Pass
Copper Mirror Test	Pass	Pass	Pass	Pass	Pass
Copper Plate Corrosion Test	Pass	Pass	Pass	Pass	Pass
Surface Insulation Resistance (SIR)	>1×1011	>1×1010	>1×1011	>1×1011	>1×1011 after cleaning
Electro Migration	Pass	Pass	Pass	Pass	Pass after cleaning
Characteristic	See Note 4	See Note 5	See Note 6	See Note 7	See Note 8

Note:

1. SIR Test Condition:40℃,95%RH,96h

2. Electro migration test condition:65℃,85%RH

3. Diameter of Sn-Pb Tin Lead Solder Wire:0.3mmto12.0mm

4. LC--T-1: This Soldering flux satisfies the requirement of halogen free, which makes it widely used.

5. LC--H-1: It is suited to assist solder nickel plating element and lamp holder.

6. LC--P-1: It is applied for helping solder zinc end of capacitor.

7. LC--HF01: This soldering flux is almost completely free from halogen.

8. LC--WS01: Its soldering residue can be cleaned with water.