Bi58Sn42 Sn Bi Solder(Tin Bismuth Alloy Solder)

Bi58Sn42 Sn Bi Solder(Tin Bismuth Alloy Solder)

Description

Low temperature lead free Sn-Bi alloy solder is with solid core. We have been engaged in research and develop of soldering techniques and solder production equipments. Up to now, a unique manufacturing technique has come into being and is popularly accepted by customers.




Features

1. Sn-Bi alloy solder has low melting point.

2. It is necessary for this solid core solder wire to coat flux when soldering.

3. Tin bismuth solder has characteristics of uniform texture, good continuity, bright color and luster, etc.

4. Our products meet ROHS and REACH standards.

Parameters of Sn-Bi Alloy Solder

Alloy Compositions

Melting Point(℃)

Specific Gravity

Recommended Applications

Solidus

Liquidus

42Sn-58Bi

139

139

8.70

Manual Dip Soldering and Wave Soldering

Ingredients Table of Sn-Bi Alloy Solder

Elements

  Sn

Bi

Pb

 Al

Sb

As

Cu

Fe

Zn

Cd

Ag

Ni

In

Content/%

41.0-43.0

Remain

0.05

0.005

0.05

0.03

0.08

0.01

0.003

0.002

0.05

0.01

0.05

Type of Tin Bismuth Solder Wire and Bar

1.  Bi58Sn42 Sn-Bi Alloy Solder Wire

2.  Bi58Sn42 Sn-Bi Alloy Solder Bar

Suggestions

To realize better soldering performance during low temp soldering, the temperature range of soldering tip should be kept from190℃to220 ℃. In addition, the angle formed by soldering tip and the working surface should range from 30°to 45°. To make it easy to deliver solder, the soldering tip should be connected with both the lead wire in electronic elements and the surface of PCB bonding pad.

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